With the exponential surge in demand for computing power driven by artificial intelligence, GPU and TPU chips are becoming increasingly integrated and power-dense. Consequently, heat generation per unit volume has risen sharply, rendering traditional thermal management solutions inadequate against persistent cooling demands and complex operating conditions.
AI-generated conceptual image
In cold plate design, internal geometry directly dictates fluid flow paths and temperature distribution. Critical performance indicators—such as peak temperature, flow field uniformity, and operational reliability—are intrinsically linked to preliminary design choices. Addressing these challenges, the BLT Product Design Team has introduced “Gradient Minimal Surface” heat exchange structures, unveiling four new additive-manufactured cold plate models designed to inspire new directions and manufacturing solutions for the thermal management industry.
Rendering of Minimal Surface Cold Plate
These specialized surface structures significantly improve temperature uniformity across the cold plate surface. Furthermore, as fluid flows through the plate along a preset direction, the structure enhances heat exchange efficiency, thereby boosting overall cooling performance. The design also ensures uniform stress distribution with no apparent weak points, providing robust mechanical load-bearing capacity while resisting warping or deformation. Leveraging the advantages of 3D printing, this offers a high-efficiency solution for chip thermal management.
Rendering of Minimal Surface Cold Plate D-1
Rendering of Minimal Surface Cold Plate G-1
BLT’s four minimal surface cold plates are fabricated from pure copper (Cu) and feature standardized dimensions of 50mm×50mm×7mm. This form factor allows flexible adaptation to compact installations for various chip modules, making them particularly suitable for high-efficiency thermal deployment in space-constrained environments. All four models were printed using the BLT-S210 equipment with a fine layer thickness of 20μm. This precision ensures the integrity of delicate features and enhances the accuracy and quality of both surface finish and internal flow channels, laying a solid foundation for optimized heat transfer performance.
Pure copper is distinguished by its exceptional thermal conductivity among common metallic materials, ensuring rapid heat conduction to prevent localized overheating and support sustained chip operation. BLT’s green laser technology provides a breakthrough solution for printing copper and other precious metals. It successfully overcomes industry pain points associated with traditional infrared systems, such as low density and low efficiency when processing copper. By optimizing laser absorption and forming stability, BLT ensures that the internal structure of the copper cold plates is uniformly dense with unobstructed thermal pathways, while simultaneously boosting printing efficiency and part quality.
